Xcerra Corporation offers a comprehensive portfolio of solutions and technologies, and a global network of strategically deployed applications and support resources. ECT is a company of Xcerra™ Corporation, which provides capital equipment, interface products, and services to the semiconductor, industrial, and electronics manufacturing industries. ECT POGO ® contacts are marketed worldwide through sales offices in the United States, Europe and Asia. Methods for maintaining electrical continuity in miniature probes, improved spring technologies, and probe head geometries are under continual review. R&D programs address engineering and materials issues that will affect Contact Solutions for the next decade. Additional information can be found at and ShareĮCT (headquartered in Fontana, CA) is the world's leading manufacturer of POGO ® contact probes for a wide range of applications including industrial, medical, military, connectors and testing bare and loaded printed circuit boards. It combines design, materials and platings expertise along with probe fabrication knowledge.”Ībout Everett Charles Technologies (ECT):ĮCT (headquartered in Fontana, CA) is the world's leading manufacturer of POGO ® contact probes for a wide range of applications including industrial, medical, military, connectors and testing bare and loaded printed circuit boards. EDGE is ECT’s answer to your most challenging test contact applications. EDGE tip geometries have also been optimized to make sustainable, reliable contact to PCB targets such as vias. In addition, the spring design has changed to reduce stress and increase life. The results are a more consistent set of mechanical parameters and electrical performance. Tony DeRosa, Product Manager, explains: “Recently ECT has enhanced key processes related to probe assembly. Additionally, EDGE probes apply ECT’s proven Micro-Wipe bias technique that provides low and consistent internal contact resistance. The tip radius is 0.0003” and is about 10 times sharper than typical machined probe tips. LFRE improves tip performance while helping maintain tip sharpness.ĮDGE probes feature an ultra-sharp tip geometry that is capable of penetrating debris, oxide and OSP layers. LFRE has a hardness range of 550 to 650 Knoop. LFRE plating is significantly harder than the industry’s standard gold plating.
#HIGH PERFORMANCE PROBE FREE#
Lead free solder resin and oxides can also increase debris transfer to spring probes.ĮCT’s EDGE probes meet these challenges as well as those found in OSP (organic solderability preservatives) and no-clean applications by combining innovative probe design with the ultra-hard plating material - ECT’s proprietary LFRE hard plating. This thicker layer of resin and oxide is more difficult to penetrate and increases wear on the pogo pin. Lead free solder has a higher reflow temperature, which can result in harder and stickier solder flux resin and a thicker, harder oxide layer. Lead free solder is known to cause many problems during in-circuit testing. In many applications effective electrical contact is compromised.
In volume manufacturing the impact worsens as cycle count increases and elevated levels of debris are transferred to the probe tips.
Everett Charles Technologies’ (ECT) EDGE probes are the answer to poor first pass yield, short probe life and excessive cleaning cycles, when caused by oxide layer build up or debris, particularly in lead free applications.
0 kommentar(er)
